global memoryWafermanufacturer leadingSAMSUNGElectronics may almost triple production of high-bandwidth memory (HBM) chips this year to capture artificial intelligence (AI) share.Aye) Memory chip market leadership. In addition, SK Hynix, which leads the HBM market, admitted that it wants to build a chip packaging plant in the United States.

The Korea Economic Daily reported that Hwang Sang-joong, executive vice president and head of the DRAM product and technology division of Samsung Electronics, said at the MEMCON 2024 event held in San Jose, California, US on the 26th, that he expects Samsung Electronics’ HBM. Production this year will increase 2.9 times from last year, which is 2.5 times more than the estimate made by Samsung Electronics at the Consumer Electronics Show (CES) in Las Vegas earlier this year.

He said that after the start of mass production of the third-generation HBM2e and fourth-generation HBM3, Samsung Electronics will start mass production of 128GB DDR5 based on 12-layer fifth-generation HBM and 32GB in the first half. is planned. Year. “With these products, we expect to strengthen our market share of efficient, high-capacity memory in the AI ​​era.”

Samsung Electronics also released an HBM development roadmap, expecting that HBM shipments in 2026 will be 13.8 times higher than those in 2023, and HBM annual output in 2028 will be 23.1 times higher than that in 2023. The company also demonstrated its first 12-stack HBM3E DRAM “HBM3E 12H” chip. It has already shipped samples to customers and plans to start mass production in the first half of this year.

According to a Nikkei report, after the media revealed that SK Hynix planned to invest nearly 4 billion US dollars to build a factory in Indiana, SK Hynix CEO Guo Luzheng admitted on the 27th That “he is considering building a factory, but nothing has been finalized yet.” ,

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