Bloomberg News reported,Ministry of CommerceThe US$3 billion budget will be used to promote plans to revitalize the United States.WaferAdvanced Packaging Industry. This link is a major reason why the United States is concerned that the semiconductor supply chain is controlled by Asian countries. The Commerce Ministry will begin issuing the first round of funding opportunities for the packaging industry early next year.
TSMC in the United StatesinvestIn Phoenix, where the US$40 billion factory is located, Arizona Governor Katie Hobbs once said that TSMC is discussing whether to include packaging capacity in the investment plan. South Korean semiconductor giant SK Hynix has announced that it will invest US$15 billion in an advanced packaging plant in the United States.
The National Advanced Packaging Initiative, which promotes packaging industry solutions in the United States, is the first major R&D investment from the Chip and Technology Act passed in 2022. The American Chip Act aims to revive chip manufacturing in the United States, as research and development of this key electronic component is now the main battlefield in the geopolitical conflict between the United States and China. Funding for packaging solutions comes from the Research and Development category and is a separate funding project from the chip manufacturing awards.
Chip packaging is an industry that combines individual chips for use in different products. Packaged chip components can be used in commercial products such as phones and automobiles, as well as in military applications, including nuclear bombs.
The Commerce Department said the United States currently accounts for only 3% of global chip packaging capacity, while China accounts for 38%. By comparison, Washington is concerned that the United States would be vulnerable to damage.
“After chips are manufactured in the United States, they have to be shipped abroad for packaging, which poses a risk to both the supply chain and national security,” Commerce Deputy Secretary Laurie LoCascio said Monday while attending a university event in Maryland. produces.” Really unacceptable.” He said that by the end of 2020, the United States will have a large number of advanced packaging plants that can do advanced packaging of the most sophisticated chips on a commercial scale and become a global leader in this industry.
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